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XCZU11EG-1FFVF1517I

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Manufacturer No:

XCZU11EG-1FFVF1517I

Manufacturer:

Xilinx

HK JDW NO:

903-XCZU11EG-1FFVF1517I

Package:

1517-BBGA, FCBGA

ECAD Model:

Description:

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 464 I/O

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC has been developed.Package 1517-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides users with reliable performance.Internally, this SoC design uses the MCU, FPGA technique.In the Zynq? UltraScale+? MPSoC EG series, this system on chip SoC is included.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.In addition, this SoC security combines Zynq?UltraScale+? FPGA, 653K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 464 I/Os.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU11EG-1FFVF1517I System On Chip (SoC) applications.

  • Mobile market
  • Keyboard
  • RISC-V
  • Measurement testers
  • Smart appliances
  • Central alarm system
  • Industrial automation devices
  • Print Special Issue Flyer
  • Microprocessors
  • Special Issue Information
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4. Shipping Cost

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Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

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DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
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From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

XCZU11EG-1FFVF1517I

technical specifications, attributes, parameters and parts with similar specifications to XCZU11EG-1FFVF1517I.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    11 Weeks

  • Package / Case

    1517-BBGA, FCBGA

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Published

    2016

  • Series

    Zynq® UltraScale+™ MPSoC EG

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    4 (72 Hours)

  • HTS Code

    8542.31.00.01

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • Number of I/O

    464

  • Speed

    500MHz, 600MHz, 1.2GHz

  • RAM Size

    256KB

  • Core Processor

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

  • Peripherals

    DMA, WDT

  • Connectivity

    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Architecture

    MCU, FPGA

  • Primary Attributes

    Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

  • RoHS Status

    ROHS3 Compliant

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